发明名称 POLYCRYSTALLINE SILICON SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME
摘要 PROBLEM TO BE SOLVED: To provide a polycrystalline silicon semiconductor device and a manufacturing method of the same. SOLUTION: An unnecessary silicon substance at portions other than a gate is removed in a manufacturing process in order to decrease parasitic capacitance caused by a silicon substance layer which exists in a line for gate-sharing. The silicon substance layer locally exists only in the lower part of the gate. Consequently, a decrease in the parasitic capacitance suppresses signal delay to provide a polycrystalline silicon semiconductor device of a thin film transistor having good electrical properties. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197727(A) 申请公布日期 2005.07.21
申请号 JP20040380811 申请日期 2004.12.28
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIM DO-YOUNG;NOGUCHI TAKASHI
分类号 H01L29/786;H01L21/20;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/423;(IPC1-7):H01L21/336 主分类号 H01L29/786
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