发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for fully activating impurities without thermally damaging a gate electrode even if photo-annealing is used. SOLUTION: When manufacturing a polycrystalline silicon TFT1, a gate electrode 6 is formed using silver as a conductive material having a wavelength of 300-700 nm and an average reflection factor of 50% or higher. Then, high-intensity light is applied from a side on which the gate electrode 6 is formed, a polycrystalline silicon film 4 is annealed via a gate insulating film 5, and impurities introduced to the polycrystalline silicon film 4 are activated. Since the gate electrode 6 reflects the large part of light, it is not thermally damaged. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197450(A) 申请公布日期 2005.07.21
申请号 JP20040002092 申请日期 2004.01.07
申请人 SEIKO EPSON CORP 发明人 YASUMATSU TAKUTO
分类号 H01L21/20;H01L21/265;H01L21/336;H01L29/786;(IPC1-7):H01L21/336 主分类号 H01L21/20
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