发明名称 |
METHOD FOR TREATING SUBSTRATE IN WET PROCESS AND TREATMENT APPARATUS THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To chemical-treat a substrate while easily avoiding gases from remaining on the surface of the substrate and the composition and temperature of the chemical solution from varying between the edge part and the central part of the substrate. SOLUTION: The treatment method comprises: holding the rear surface of the substrate while directing the front surface downward when treating the substrate with a chemical solution in a wet process; immersing the substrate of which the rear surface is held into the chemical solution pooled in a treatment tank to chemically treat the substrate; and cleaning the surface, the edge and the rear surface of the substrate after having finished the chemical treatment. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005194613(A) |
申请公布日期 |
2005.07.21 |
申请号 |
JP20040004819 |
申请日期 |
2004.01.09 |
申请人 |
EBARA CORP |
发明人 |
FUKUNAGA AKIRA;OWATARI AKIRA;SEKIMOTO MASAHIKO |
分类号 |
C23C18/31;H01L21/304;H01L21/677;H01L21/68;(IPC1-7):C23C18/31 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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