| 摘要 |
The invention relates to a method of forming electrical connection means on a substrate, which method comprises the following steps: a) depositing an intermediate layer of material ( 14 ) on a substrate ( 10 ), b) forming an etching mask having at least one window, c) etching the layer of intermediate material in conformity with the mask in order to form at least one aperture therein, d) coating the lateral side-walls of the aperture with a spacer ( 22 ) in order to narrow the aperture, e) depositing at least one conductor material ( 24 ) so as to fill the narrowed aperture, and f) performing an abrasion operation so as to remove excess conductor material outside the aperture. The invention is used for the realization of wiring tracks, contact pads and vias.
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