| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin curing type conductive paste reducing resistivity regardless of combination amount of metal powder like silver as a conductive component, having good adhesive force with a base material. SOLUTION: The resin curing type conductive paste contains thermosetting resin, metal powder, and metal resinate. The resinate is added to the metal powder by not less than 0.3 wt.% and not more than 10 wt.%. the resin curing type conductive paste contains the metal powder by not less than 55 wt.% and not more than 95 wt.%. COPYRIGHT: (C)2005,JPO&NCIPI
|
