| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermally curable resist composition which is suitable for a solder resist or an interlayer insulating film and is capable of forming a highly precise pattern by suppressing bleeding caused after screen printing and sagging occurred during heating, and to provide its curing method and use. SOLUTION: The resist composition is characterized in that it comprises (A) a crystalline resin having reactive groups on both terminals, and there are provided ink comprising the resist composition and a coloring agent, a curing method for the resist composition, a thermally cured product of the resist composition, a protective insulating film and an interlayer insulating film which are composed of the resist composition, and a printed circuit board having the films. COPYRIGHT: (C)2005,JPO&NCIPI |
