POWER POTENTIAL-FREE MODULE HAVING A HIGH INSULATION VOLTAGE

摘要

The invention relates to producing power modules based on diodes, transistors and similar semiconductor devices and can be used for high-voltage converter engineering in different industries, transport, energy and municipal engineering. The inventive power module is provided with soldered or pressed contacts and consists of a base, a thermal compensator, metal-ceramic plates, semiconductor elements and a body. Said semiconductor elements are fixed to the top metal-ceramic plate of the module. A certain number of metal-ceramic plates (1, 2, 3, n) and the thermal compensator, which is connected to the lower metal-ceramic plate by the contact surface thereof and to the module base by the other surface thereof, are mounted between said plate and the base. The sizes of the contact surface of the thermal compensator faithfully copy the sizes of the metal coating of the metal ceramic plate contacting therewith, the thickness of the thermal compensator must be equal to or greater than the length of the insulating space between the edge of the plate and the edge of the metal coating.