发明名称 |
FOLDED FIN MICROCHANNEL HEAT EXCHANGER |
摘要 |
<p>Folded fin microchannel heat exchangers for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. The heat exchangers include a folded fin enclosed within the heat exchanger thereby defining a plurality of microchannels. In one embodiment, a folded fin microchannel heat exchanger is operatively coupled to an IC die or IC package using fasteners and is thermally coupled to the IC die or an IC package using a thermal interface material. In other embodiments, a folded fin microchannel heat exchanger is operatively and thermally coupled to an IC die or an IC package using a thermal epoxy or a solderable material. The folded fin microchannel heat exchangers may be employed in a closed loop cooling system includes a pump and a heat rejecter. The folded fin microchannels are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.</p> |
申请公布号 |
WO2005067038(A1) |
申请公布日期 |
2005.07.21 |
申请号 |
WO2004US43646 |
申请日期 |
2004.12.22 |
申请人 |
INTEL CORPORATION;POKHARNA, HIMANSHU;PRASHER, RAVI |
发明人 |
POKHARNA, HIMANSHU;PRASHER, RAVI |
分类号 |
F28F3/02;H01L23/427;H01L23/473;H05K7/20;(IPC1-7):H01L23/427 |
主分类号 |
F28F3/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|