| 发明名称 |
SMALL VOLUME PROCESS CHAMBER WITH HOT INNER SURFACES |
| 摘要 |
<p>A system and method of processing a substrate including loading a substrate into a plasma chamber and setting a pressure of the plasma chamber to a pre-determined pressure set point. Several inner surfaces that define a plasma zone are heated to a processing temperature of greater than about 200 degree C. A process gas is injected into the plasma zone to form a plasma and the substrate is processed.</p> |
| 申请公布号 |
WO2005067005(A1) |
申请公布日期 |
2005.07.21 |
| 申请号 |
WO2004US40865 |
申请日期 |
2004.12.06 |
| 申请人 |
LAM RESEARCH CORPORATION |
发明人 |
BAILEY, ANDREW, D., III;NI, TUQIANG |
| 分类号 |
H01J37/32;H01L21/00;H01L21/302;H01L21/321;H01L21/3213;H01L21/44;H01L21/461;H01L21/4763;H01L21/683;H01L21/768;H01L23/48;H01L23/52;H01L29/24;H01L29/40;H01L33/00;(IPC1-7):H01L21/00 |
主分类号 |
H01J37/32 |
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