| 发明名称 |
POLYIMIDE ADHESIVE COMPOSITION USEFUL FOR APPLICATION TO FLEXIBLE CIRCUIT, AND RELATED CONSTITUTION AND METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low modulus halogen-free polyimide adhesive applicable at a comparatively low adhesive temperature to a flexible circuit. <P>SOLUTION: The polyimide adhesive composition comprises a low modulus polyimidesiloxane polymer, a thermosetting substantially halogen-free epoxy (optionally contain an epoxy catalyst), a plasticizer, an insoluble halogen-free flame retardant filler and optionally an adhesion accelerator. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005194527(A) |
申请公布日期 |
2005.07.21 |
| 申请号 |
JP20040372026 |
申请日期 |
2004.12.22 |
| 申请人 |
E I DU PONT DE NEMOURS & CO |
发明人 |
AUMAN BRIAN C;DUEBER THOMAS E;KASOWSKI ROBERT V;WEST MICHAEL W |
| 分类号 |
C08L79/08;B32B27/08;B32B27/18;C08G65/336;C08G77/455;C08K5/00;C08K5/34;C08L63/00;C08L71/02;C08L83/04;C08L83/10;C08L83/14;C09D183/10;C09J7/00;C09J11/00;C09J179/08;C09J183/10;H01L21/60;H05K1/00;H05K1/03;H05K3/28;H05K3/38;H05K3/46;(IPC1-7):C08L79/08 |
主分类号 |
C08L79/08 |
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