发明名称 ELECTROLESS GOLD PLATING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a plating liquid which can attain a gold deposition rate of≥0.4μm per hr at 60°C, preferably, of 0.5 to 1.2μm, has excellent stability, enables continuously satisfactory electroless gold plating over a long period and puts no load on the environment. SOLUTION: The electroless gold plating liquid contains a gold salt, a complexing agent, a reducing agent, and one or more kinds selected from glycolic acid, diglycolic acid and their salts. As the complexing agent, water soluble polyaminocarboxylic acid and/or the salt thereof is contained, and its content is controlled to≤50 g/L. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005194569(A) 申请公布日期 2005.07.21
申请号 JP20040001433 申请日期 2004.01.06
申请人 NE CHEMCAT CORP 发明人 FURUKAWA MASATO;YAMAGUCHI HIROYUKI
分类号 C23C18/44;(IPC1-7):C23C18/44 主分类号 C23C18/44
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