ADHERENT RESIN COMPOSITION, FILM ADHESIVE AND SEMICONDUCTOR USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adherent resin composition which allows a polyimide resin to be applied as an interlaminar adhesive film of circuit boards and is used in a film adhesive excellent in adhesion and heat resistance, a film adhesive composed thereof, and a semiconductor using the film adhesive. SOLUTION: The heat-resistant resin composition comprises 100 pts. wt. thermoplastic polyamidimide obtained by reacting a diamine component containing an aliphatic diamine having a specific structure and other diamines other than the aliphatic diamine with trimellitic monoanhydride and a tetracarboxylic dianhydride and 1-200 pts. wt. thermosetting resin. COPYRIGHT: (C)2005,JPO&NCIPI