发明名称 THERMOSETTING POLYAMIDE FOAM AND USE THEREOF, AND METHOD FOR PRODUCING THERMOSETTING POLYAMIDE
摘要 <p>A thermosetting polyamide foam which is produced by reacting a polyisocyanate compound and a polyester carboxylic acid under a condition, wherein an NCO index is 1.6 or more, using a compound having a P=N bond as a catalyst. The polyamide foam is excellent in heat resistance (thermal decomposition characteristics) and mold formability, and thus, can be suitably used as a heat-resistant damping material, a heat-resistant sound-absorbing material and a heat-resistant cushioning material.</p>
申请公布号 WO2005066235(A1) 申请公布日期 2005.07.21
申请号 WO2005JP00067 申请日期 2005.01.06
申请人 MITSUI TAKEDA CHEMICALS, INC.;IWA, TSUYOSHI;SHIBATA, TATSUYA;OKUBO, KAZUHIKO 发明人 IWA, TSUYOSHI;SHIBATA, TATSUYA;OKUBO, KAZUHIKO
分类号 C08G18/16;C08G18/42;(IPC1-7):C08G18/16;C08G69/44 主分类号 C08G18/16
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