发明名称 |
THERMOSETTING POLYAMIDE FOAM AND USE THEREOF, AND METHOD FOR PRODUCING THERMOSETTING POLYAMIDE |
摘要 |
<p>A thermosetting polyamide foam which is produced by reacting a polyisocyanate compound and a polyester carboxylic acid under a condition, wherein an NCO index is 1.6 or more, using a compound having a P=N bond as a catalyst. The polyamide foam is excellent in heat resistance (thermal decomposition characteristics) and mold formability, and thus, can be suitably used as a heat-resistant damping material, a heat-resistant sound-absorbing material and a heat-resistant cushioning material.</p> |
申请公布号 |
WO2005066235(A1) |
申请公布日期 |
2005.07.21 |
申请号 |
WO2005JP00067 |
申请日期 |
2005.01.06 |
申请人 |
MITSUI TAKEDA CHEMICALS, INC.;IWA, TSUYOSHI;SHIBATA, TATSUYA;OKUBO, KAZUHIKO |
发明人 |
IWA, TSUYOSHI;SHIBATA, TATSUYA;OKUBO, KAZUHIKO |
分类号 |
C08G18/16;C08G18/42;(IPC1-7):C08G18/16;C08G69/44 |
主分类号 |
C08G18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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