发明名称 ELECTRONIC COMPONENT PACKING METHOD AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component packing method which enables packing an electronic component of directivity by a single specification. <P>SOLUTION: In the electronic component packing method using a carrier tape in which an electronic component is stored in a cavity formed of a through hole in a base tape, and the cavity is covered by a cover tape affixed to the base tape, a peelable cover tape is affixed to one side of the base tape, the electronic component is stored in the cavity formed by the affixed cover tape and the through hole in the base tape, a peelable cover tape is affixed to the other side of the base tape. In the mounting, the electronic component is stored in the cavity, the direction of the carrier tape is changed according to the electronic component mounting method, and the electronic component stored in the carrier tape is taken out and mounted while peeling either cover tape located on the top side. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005193935(A) 申请公布日期 2005.07.21
申请号 JP20040000868 申请日期 2004.01.06
申请人 RENESAS TECHNOLOGY CORP;HITACHI HYBRID NETWORK CO LTD 发明人 SUDO KAZUO;KIKUCHI SAKAE;DEURA AKIRA;NISHI TAKAHIRO
分类号 B65D73/02;B65B15/04;B65D85/86;H05K13/02 主分类号 B65D73/02
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