SUBSTRATE FOR MULTILAYER WIRING CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING MULTILAYER WIRING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a high-density multilayer wiring board which can obtain a highly reliable IVH (interstitial via hole) interlayer connection and have a high yield in an IVH using conductive nano-paste. SOLUTION: Uncured conductive nano-paste 24 is filled into a via hole (hole 23) made for interlayer conduction from one side of the hole, and the conductive nano-paste 24 filled in the via hole from the other side of the via hole using a hot plate 50 or the like. Unset conductive nano-paste 24 is additionally filled at least one time into the via hole from one side of the via hole so as to compensate for a volume shrinkage of the conductive nano-paste 24 caused by the setting. COPYRIGHT: (C)2005,JPO&NCIPI