| 摘要 |
PROBLEM TO BE SOLVED: To prevent short-circuit between metal bumps, to secure stable solder connection quality, and to prevent dislocation and a fitting mistake in a fitting direction when a BGA-type IC package is fitted in a fitting structure of the BGA-type IC package. SOLUTION: The BGA-type IC package 1 is provided with partition strips 12 and 13 for preventing short-circuit between the solder bumps 11, and positioning parts 14 and 15 formed in such a way that a part of the partition strips 12 and 13 becomes higher than the other part of the partition strips 12 and 13 at a rear face 1a of the package. A printed wiring board has engagement holes into which the positioning parts 14 and 15 are inserted. The BGA-type IC package 1 is fitted to the printed wiring board in a state where the solder bumps 11 are divided by the partition strips 12 and 13, by inserting the positioning parts 14 and 15 into the insertion holes. COPYRIGHT: (C)2005,JPO&NCIPI
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