| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce electrical short between adjacent electrodes by restraining creeping-up of solder to a side surface of a bump's seating portion. <P>SOLUTION: The bump 1 is provided with the seating portion 4 formed on an electrode 3 which is arranged in a semiconductor chip 2, and a projection part 5 which is formed in the almost center of the seating portion. The bump 1 has a first circular protruded part 6 which surrounds the seating portion and is lower than the projection part, and a second circular protruded part 7 which is protruded from the seating portion, surrounds the first protruded part and is lower than the projection part. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
