| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of electronic components for coping with the miniaturization, high performance, and high quality of a lamination type electronic component. SOLUTION: A conductive substrate in which a mask using an electrode formation region as a negative pattern is used to form an internal electrode in a prescribed thickness by an electrodeposition process, the internal electrode is transferred onto the surface of a light transmitting substrate and the upper surface is coated with photosensitive ceramic slurry, and the photosensitive ceramic slurry is exposed by a prescribed thickness from the rear of the light transmitting substrate, thus obtaining an internal electrode inclusion type ceramic green sheet in which the thickness of the internal electrode is nearly equal to that of a ceramic part. COPYRIGHT: (C)2005,JPO&NCIPI
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