CIRCUIT CONNECTION MATERIAL, FILM-LIKE CIRCUIT CONNECTION MATERIAL USING THE SAME, CONNECTION STRUCTURE OF CIRCUIT MEMBER AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a circuit connection material capable of reducing and stabilizing connection resistance between facing circuit electrodes, and of sufficiently improving an insulating property between circuit electrodes adjacent to each other; to provide a film-like circuit connection material using it; and to provide a connection structure of circuit members and its manufacturing method. SOLUTION: This connection structure 10 of circuit members is equipped with: the circuit members 20 with a plurality of circuit electrodes 22 formed on a principal surfaces 21a of a circuit boards 21; and a circuit member 30 with a plurality of circuit electrodes 32 formed on a principal surfaces 31a of a circuit boards 31. A circuit connection member 60 for connecting the circuit members 20 and 30 to each other so as to face the circuit electrodes 22 and 32 to each other is formed of a hardened material of this circuit connection material. The circuit connection material contains an adhesive composition, and coated particles 50 formed by partially coating surfaces 51a of conductive particles 51 with insulating fine particles 52, and the specific gravity of the insulating fine particles 50 is 97/100 to 99/100 as much as that of the conductive particles 51. COPYRIGHT: (C)2005,JPO&NCIPI