发明名称 SUBSTRATE-PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To shorten maintenance time for a substrate-processing apparatus and increase a throughput of the substrate-processing apparatus by providing the substrate-processing apparatus, having a buffer chamber capable of easily discharging liquid inside the buffer chamber. SOLUTION: The substrate processing apparatus includes a reaction tube 203 for forming a space for accommodating and processing a substrate, a plurality of gas supply holes 248 for supplying processing gas into the reaction tube 203, and an isolation chamber 237, having a desired space provided integrally on the reaction tube 203. The substrate processing apparatus has an opening 10, provided at the corner of the isolation chamber 237 for discharging a cleaning solution used when cleaning the reaction tube 203. Consequently, even if a liquid is to infiltrate the isolation chamber 237, the liquid can be discharged rapidly from the opening 10. Accordingly, the cleaning time for the reaction tube 203 is shortened, and hence the maintenance time of the substrate processing apparatus can be shortened, and further, the throughput of the substrate processing apparatus can be improved. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197565(A) 申请公布日期 2005.07.21
申请号 JP20040003944 申请日期 2004.01.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 OKUDA KAZUYUKI;SHIMA NOBUHITO;KONYA TADASHI
分类号 C23C16/44;H01L21/22;H01L21/31;H01L21/324;(IPC1-7):H01L21/31 主分类号 C23C16/44
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