发明名称 METHOD FOR TREATING SUBSTRATE IN WET PROCESS AND APPARATUS FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To make the surface of a substrate more uniformly chemical-treated while easily avoiding gases from remaining on the surface of the substrate and the concentration and temperature of the chemical solution from varying between the edge part and the central part of the substrate. SOLUTION: The method for treating the substrate in a wet process comprises: before forming an insulating coating film or a coating film of a metal or an alloy on an exposed surface of a metal formed on the substrate surface, preparing an acidic solution previously controlled into a predetermined concentration range; and continuously spraying the acidic solution previously controlled into the predetermined concentration toward the substrate at a predetermined pressure to make the solution into contact with the substrate surface. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005194585(A) 申请公布日期 2005.07.21
申请号 JP20040002862 申请日期 2004.01.08
申请人 EBARA CORP 发明人 FUKUNAGA AKIRA;OWATARI AKIRA;SEKIMOTO MASAHIKO
分类号 C23C18/18;C23C18/16;C23F1/08;H01L21/28;H01L21/304;(IPC1-7):C23C18/18 主分类号 C23C18/18
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