| 摘要 |
A microcomponent connection system ( 1 ) having an accomodation device for plate-shaped microcomponents ( 7 ) has a connection block ( 2 ) and a lifting device ( 6 ), by means of which the microcomponent ( 7 ) and the connection block ( 2 ) can be pressed against one another. The connection block ( 2 ) has electrical and fluid line connections ( 8, 9 ) and optical line connections ( 16 ), each of which projects in a sprung or spring-mounted manner on the underside of the connection block ( 2 ). In order to connect the microcomponent ( 7 ) to the associated line connections ( 8, 9, 16 ), the microcomponent ( 7 ) is pressed by the lifting device ( 6 ) in the direction of the connection block ( 2 ) against the electrical line connections ( 8 ) or fluid line connections ( 9 ) designed as electrically conducting spring tongues or as hollow rams ( 10 ), or optical line connections ( 16 ).
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