A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling.
申请公布号
WO2005066391(A1)
申请公布日期
2005.07.21
申请号
WO2004US41620
申请日期
2004.12.13
申请人
ENTHONE INC.;PANECCASIO, VINCENT;LIN, XUAN;FIGURA, PAUL;HURTUBISE, RICHARD
发明人
PANECCASIO, VINCENT;LIN, XUAN;FIGURA, PAUL;HURTUBISE, RICHARD
