发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.
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申请公布号 |
US2005159082(A1) |
申请公布日期 |
2005.07.21 |
申请号 |
US20050078495 |
申请日期 |
2005.03.14 |
申请人 |
SAKURAI KUNIHIKO;TOGAWA TETSUJI;TAKADA NOBUYUKI;WAKABAYASHI SATOSHI;SAITO KENICHIRO;SEKIMOTO MASAHIKO;HAYAMA TAKUJI;KOGA DAISUKE |
发明人 |
SAKURAI KUNIHIKO;TOGAWA TETSUJI;TAKADA NOBUYUKI;WAKABAYASHI SATOSHI;SAITO KENICHIRO;SEKIMOTO MASAHIKO;HAYAMA TAKUJI;KOGA DAISUKE |
分类号 |
B24B37/04;H01L21/306;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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