Semiconductor device and test method for the same

摘要

A multi-bus semiconductor device and a method of its probing test perform the DC test for individual pads of a device while dealing with an adequate number of devices for simultaneous measurement based on the scheme of input/output pad number compressive test. The semiconductor device includes switch elements SW 0 -SW 4 connected between input/output pads P 0 -P 4 and a testing line L 0 so that pads in an arbitrary combination, among the off-probe pads P 1 -P 4 that are not made in contact with the tester probe Pr 0 , are selected for testing in correspondence to the combination of switch elements that are turned on. The input/output buffers of the pads under test are deactivated to block their internal current paths. The corresponding switch elements are turned on to connect the off-probe pads under test to the probe pad P 0 that is made in contact with the tester probe Pr 0 , and the leak current of the probes is measured with the tester TS.