发明名称 |
Electronic or opto-electronic packages |
摘要 |
An electronic device such as a laser diode is mounted on a heatsink assembly within a TO-can package. The heatsink assembly is mounted in heat exchange relation with a heat pipe by being on or adjacent a heat pipe. The heat pipe is either attached to an exterior face of the TO-can package or passes into the TO-can package to efficiently draw heat away from the heatsink assembly.
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申请公布号 |
US6920162(B2) |
申请公布日期 |
2005.07.19 |
申请号 |
US20020288367 |
申请日期 |
2002.11.06 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
HARDING RYAN KINGSLEY |
分类号 |
H01L33/64;H01S5/022;H01S5/024;(IPC1-7):H01S3/04 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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