发明名称 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same
摘要 In a manufacturing apparatus of printed wiring board an aperture of a nozzle pipe located in a central position is larger than that at both sides, or the aperture of the piping to the nozzle pipe in the central position is larger than that of the piping at both sides. The mutual interval is narrower with the central nozzle pipes. The interval of the individual nozzle pipes is variable, and is also variable in the vertical direction. A pressure-proof flexible tube is provided between each nozzle pipe and the pump, and the interval of the individual nozzle pipes is variable, and is also variable in the vertical direction. Further, the spray pressure, oscillating angle, and oscillating speed can be set individually in each nozzle pipe, and such setting can be automated.
申请公布号 US6918989(B2) 申请公布日期 2005.07.19
申请号 US20010936324 申请日期 2001.12.04
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HIGA KAZUTOMO
分类号 C23F1/08;H05K3/06;(IPC1-7):H01L21/00;B05B12/00 主分类号 C23F1/08
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