| 摘要 |
In fabricating the magnetic head, a first magnetic shield layer (S 1 ) is fabricated upon a substrate base, followed by a thin first insulation layer (G 1 ). A photoresist mask is fabricated upon the G 1 layer and electrical lead recesses are milled through the G 1 layer and into the S 1 layer. An insulation layer is deposited into the electrical lead recesses, followed by the fabrication of electrical leads within the recesses. The photoresist is removed and a magnetoresistive (MR) sensor is subsequently fabricated on top of the G 1 layer, such that portions of the MR sensor are fabricated on top of portions of the electrical leads. Hard bias elements are then fabricated at outboard edges of the MR sensor. A thin second insulation layer (G 2 ) is fabricated on top of the MR sensor and hard bias elements, and a second magnetic shield layer (S 2 ) is fabricated on top of the G 2 layer.
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