发明名称 |
Method for forming TiSiN film, diffusion preventive film comprising TiSiN film, semiconductor device and its production method, and apparatus for forming TiSiN film |
摘要 |
A TiSiN film is used as a barrier metal layer for a semiconductor device to prevent the diffusion of Cu. The TiSiN film is formed by a plasma CVD process or a thermal CVD process. TiCl<SUB>4 </SUB>gas, a silicon hydride gas and NH<SUB>3 </SUB>gas are used as source gases for forming the TiSiN film by the thermal CVD process. TiCl<SUB>4 </SUB>gas, a silicon hydride gas, H<SUB>2 </SUB>gas and N<SUB>2 </SUB>gas are used as source gases for forming a TiSiN film by the plasma CVD process.
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申请公布号 |
US6919273(B1) |
申请公布日期 |
2005.07.19 |
申请号 |
US20020148952 |
申请日期 |
2002.06.07 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
OTSUKI HAYASHI;TADA KUNIHIRO;MATSUSE KIMIHIRO |
分类号 |
C23C16/34;C23C16/44;C23C16/455;H01L21/02;H01L21/28;H01L21/285;H01L21/768;H01L21/8242;H01L23/485;H01L27/108;H01L29/49;(IPC1-7):H01L21/44;H01L21/476 |
主分类号 |
C23C16/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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