发明名称 |
Heat-dissipating assembly |
摘要 |
A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.
|
申请公布号 |
US6920045(B2) |
申请公布日期 |
2005.07.19 |
申请号 |
US20030417734 |
申请日期 |
2003.04.16 |
申请人 |
DELTA ELECTRONICS, INC. |
发明人 |
HUANG WEN-SHI;LIN KUO-CHENG;TAN LI-KUANG;HUANG YU-HUNG |
分类号 |
H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/467 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|