发明名称 Heat-dissipating assembly
摘要 A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.
申请公布号 US6920045(B2) 申请公布日期 2005.07.19
申请号 US20030417734 申请日期 2003.04.16
申请人 DELTA ELECTRONICS, INC. 发明人 HUANG WEN-SHI;LIN KUO-CHENG;TAN LI-KUANG;HUANG YU-HUNG
分类号 H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/467
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