发明名称 Process for producing semiconductor chips
摘要 The present invention provides a sheet to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches. The sheet to form a protective film for chips of the present invention comprises a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component.
申请公布号 US6919262(B2) 申请公布日期 2005.07.19
申请号 US20020102583 申请日期 2002.03.20
申请人 LINTEC CORPORATION 发明人 SENOO HIDEO;SUGINO TAKASHI;YAMAZAKI OSAMU
分类号 C09J7/00;C09J133/00;C09J163/00;H01L21/301;H01L21/58;H01L21/68;H01L21/78;H01L23/00;H01L23/31;H01L23/48;(IPC1-7):H01L21/46 主分类号 C09J7/00
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