发明名称 |
Miniature 3-dimensional package for MEMS sensors |
摘要 |
An apparatus for mechanically mounting one or more Micro Electro-Mechanical System (MEMS) sensors on a stable, structurally sound base, the base being a generally cubical block formed in a ceramic substrate having a plurality of substantially planar and mutually orthogonal surfaces, wherein a first one of the surfaces is structured for rotationally interfacing with a host structure that is to be monitored; one or more of the remaining surfaces is structured for mechanically mounting of a MEMS sensor; and a plurality of electrical signal carriers communicate between each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface.
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申请公布号 |
US6918297(B2) |
申请公布日期 |
2005.07.19 |
申请号 |
US20030377439 |
申请日期 |
2003.02.28 |
申请人 |
HONEYWELL INTERNATIONAL, INC. |
发明人 |
MACGUGAN DOUGLAS C. |
分类号 |
B81B7/00;G01C21/16;G01P1/02;G01P15/18;H01R33/88;(IPC1-7):G01P9/04 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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