| 发明名称 |
Polyimide resin with reduced mold deposit |
| 摘要 |
A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
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| 申请公布号 |
US6919422(B2) |
申请公布日期 |
2005.07.19 |
| 申请号 |
US20030667820 |
申请日期 |
2003.09.22 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
GALLUCCI ROBERT R;ODLE ROY RAY;KERNICK, III WILLIAM A.;SANNER MARK ALAN |
| 分类号 |
C08G73/10;C08L79/08;(IPC1-7):C08G73/10;C08G69/28;B32B27/00 |
主分类号 |
C08G73/10 |
| 代理机构 |
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