| 摘要 |
The invention concerns a device comprising at least one extractor for extracting electronic components from a cut out wafer, the extractor(s) being actuated by a linear electromagnetic transducer. The use of a linear electromagnetic transducer, preferably a voice coil motor, for generating movements of the extractor(s) enable the device to achieve very high work rates, not less than those of most existing processing lines. The use of the same motorization for the suction head (11) removing the electronic component to be extracted as for the extractor(s), enables the synchronization of the two movements to be optimized and the quality of the extraction process to be improved.
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