Film carrier tape for semiconductor package and manufacturing method thereof

摘要

A film carrier tape and a method of forming a film carrier tape that incorporates a polymeric reinforcement film are provided for decreasing the deformation of and damage to film carrier tapes by forces resulting from contact with sprocket teeth during the semiconductor assembly process. The reinforcement film may include one or more synthetic resins and may increase the useable area of a base film used in forming film carrier tapes.