HIGH FREQUENCY INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a high frequency integrated circuit which can eliminate the need for a solder fillet during motherboard mounting and can realize strong grounding of a multilayered board. SOLUTION: The multilayered board of the high frequency circuit device is made up of an upper multilayered board 1 having a side grounding electrode 8 and a single lower substrate 2 having no side grounding electrode, the stacked board 1 and the substrate 2. A dummy ground 10 is formed on the rear surface of the upper multilayered board 1. A rear surface ground 11 and external electrode terminals 19, 20 are formed on the rear surface of the lower substrate 2. A connection from the surface of the uppermost layer of the upper multilayered board 1 to the dummy ground 10 is made by a side grounding electrode 8 formed on the side of the upper multilayered board. The dummy ground 10 and the rear surface ground 11 are connected by a first plurality of via holes 18 formed in the lower substrate 2. Consequently, strong grounding connection can be realized from the front surface to the rear surface as a multilayered board of the high frequency circuit device. COPYRIGHT: (C)2005,JPO&NCIPI