DEVICE AND METHOD FOR ELECTROLYTICALLY TREATING AN AT LEAST SUPERFICIALLY ELECTRICALLY CONDUCTING WORK PIECE
摘要
A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.
申请公布号
WO2004022814(A3)
申请公布日期
2005.07.14
申请号
WO2003EP09526
申请日期
2003.08.28
申请人
ATOTECH DEUTSCHLAND GMBH;SCHNEIDER, REINHARD;KENNY, STEPHAN;KUESSNER, TORSTEN;PLOESE, WOLFGANG;REENTS, BERT;STREUP, HERIBERT