METHOD AND APPARATUS FOR THE APPLICATION OF POWDER MATERIAL TO SUBSTRATES

摘要

Apparatuses and methods for electrostatically applying a powder material to substrates are described. A plurality of platens are provided, each arranged to hold a plurality of substrates such as solid dosage forms. Each platen is driven around an endless path and passes through a loading region in which substrates are loaded onto the platens, a developing region in which the powder material is applied to the substrates, a fusing region in which the applied powder material is fused, and an unloading region in which substrates are removed from the platens.