发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes a substrate having a first area and a second area adjacent to the first area, a first silicon layer provided on the substrate in the first area, a relaxed layer which is provided on the substrate in the second area and which has a lattice constant greater than a lattice constant of the first silicon layer, and a strained-Si layer which is provided on the relaxed layer and which has a lattice constant substantially equivalent to the lattice constant of the relaxed layer.
申请公布号 US2005151163(A1) 申请公布日期 2005.07.14
申请号 US20050026542 申请日期 2005.01.03
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HIYAMA KAORU;SANUKI TOMOYA;FUJII OSAMU
分类号 H01L21/822;H01L21/8234;H01L21/8238;H01L21/8239;H01L21/8242;H01L27/04;H01L27/06;H01L27/08;H01L27/088;H01L27/092;H01L27/105;H01L27/108;H01L29/786;H01L29/92;(IPC1-7):H01L29/10 主分类号 H01L21/822
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