| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounting semiconductor package having high heat dissipation efficiency. <P>SOLUTION: In the semiconductor package wherein a semiconductor element such as an LED element is mounted on lands of a pair of top electrodes formed on the principal plane of a ceramic substrate, a substrate 20 composed of a pair of conductors 22 and 23 formed on the right and left of an insulator 21 equipped with a light diffusion and reflection means is bonded to a pair of bottom electrodes 12c and 13c formed on the bottom face of the ceramic substrate 11. Furthermore, vias 11c and 11e formed of a conductive metal film 14 on the inner surface are formed in the ceramic substrate 11, and the conductive metal films 14 of the vias 11c and 11e are connected to the top electrodes 12a and 13a, bottom electrodes 12c and 13c, and conductors 22 and 23 to form a heat dissipation bypass path through the vias. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
