发明名称 COOLING SYSTEM AND METHOD FOR LIQUID COOLING OF ELECTRONIC SUBSYSTEMS
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent a cooling system of a computer room from breaking down owing to heat exchanger failure or control valve failure, or loss of chilled water source. <P>SOLUTION: A cooling system comprises at least two modular cooling units (MCU) and each MCU 310 provides system coolant to multiple electronics subsystems. The each MCU 310 comprises a heat exchanger 324, a first cooling loop 325 with at least one control valve 316, and a second cooling loop 327. The first cooling loop 325 receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger. The second cooling loop supplies chilled system coolant to the multiple electronics subsystems and, in the heat exchanger 324, heat is expelled from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop 325. At least one of control valve 316 controls flow and temperature of the facility coolant. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005191554(A) 申请公布日期 2005.07.14
申请号 JP20040347711 申请日期 2004.11.30
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 RICHARD C CHUU;ELLSWORTH JR MICHAEL J;SCHMIDT ROGER R;SIMONS ROBERT E;TSUKAMOTO TAKESHI
分类号 F25D17/02;F25D9/00;G06F1/20;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D17/02
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