| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetic substrate whose principal material is a silicon copper plate and which is formed by laminating the silicon copper plate by a resin layer, has high mechanical strength and heat resistance, is excellent in soft magnetic property, shows remarkably little magnetostriction and iron loss and does not generate peeling of the silicon copper plate or the like even if it is used for a long period of time. SOLUTION: A resin layer which consists primarily of a heat resistant thermoplastic resin is formed in a part or an entire surface of one side or both sides of the silicon copper plate. As for the heat resistant thermoplastic resin, specific thermoplastic polyimide resin is preferable. COPYRIGHT: (C)2005,JPO&NCIPI
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