| 摘要 |
PROBLEM TO BE SOLVED: To form a metal film or a metal compound film while securing a high adhesion property on a porous insulating film. SOLUTION: The porous insulating film is formed on a substrate, and the metal film or the metal compound film is formed on the insulating film. In this case, conditions of the film formation of the metal film or the like are changed, and a diffusion layer in which metal or a metal compound included in the metal film or the metal compound film is diffused to the insulating film is formed between the metal film or the metal compound, and the insulating film. The diffusion layer increases the adhesion property between the metal film and the porous insulating film. COPYRIGHT: (C)2005,JPO&NCIPI
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