Bonding wire and an integrated circuit device using the same

摘要

A bonding wire comprising a core mainly consisting of copper, a different metal layer formed of a metal other than copper and formed on the core, and a coating layer formed of an oxidation-resistant metal having a melting point higher than that of copper and formed on the different metal layer, from which balls having the shape of a true sphere in a wide ball diameter range can be formed stably, which can be produced without causing the deterioration of a plating solution at the time of plating, and in which the adhesiveness between the coating layer and the core thereof is excellent; and an integrated circuit device using the bonding wire are provided.