LED or laser diode component production includes hard soldering semiconductor to conductive frame and fitting housing to surround frame which melt bonds to frame during soldering

摘要

A light emitting element e.g. LED or laser diode has a pre-prepared bond with a lead frame (8) connected to a plastics containing housing. Semiconductor chip (1) is attached to the lead frame using a hard solder bond. The housing is preferably die-, injection moulded or transfer moulded and at least partially surrounds the lead frame and keeps its shape at the melting point of the hard solder. A heat sink (6) is preferably included between the lead frame and te mounting frame.