MANUFACTURING METHOD OF CHIP TYPE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing method of a chip type electronic component which can suppress the deformation of its substrate caused by its stress generated when dicing it, and is excellent in a shape stability.

SOLUTION: The manufacturing method has a process for sticking on a UV tape 17 having an adhesive layer 17b a sheet-form substrate 11 provided with resistive substances (functional elements) 13, a process for hardening thereafter the adhesive layer 17b by irradiating the UV tape 17 by ultraviolet rays, and a process for cutting thereafter the sheet-form substrate 11 by a dicing working method.

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