Semiconductor device and method of manufacturing the same

摘要

A semiconductor device includes a substrate having a first area on which a semiconductor element is mounted, a second area which surrounds the first area, and a third area located in a central portion of the first area; wirings extending from the second area to the third area and formed over the substrate; and an insulting film which is formed in the first and second areas so as to expose the third area and to cover portions of the substrate and the wirings. The semiconductor element which is electrically connected to the wirings within the third area. The semiconductor element has a size equal to the first area and is mounted on the first area so as to be spaced a predetermined interval from the insulating film.