发明名称 Photoresist pattern, method of fabricating the same, and method of assuring the quality thereof
摘要 A photoresist pattern and a method of fabricating the same make it easy to quickly identify a particular portion of a photolithography process that is responsible for causing process defects. The method of fabricating the photoresist pattern includes forming main patterns having a predetermined critical dimension in device-forming regions of a semiconductor substrate, and forming a plurality of test patterns in scribe regions of the substrate. The scribe regions are defined alongside the device-forming regions and separate the device-forming regions from one another. The test patterns have shapes similar to that of the main patterns. Also, one of the test patterns has a critical dimensions similar to that of the main patterns, and other test patterns have respective critical dimensions that are different from the critical dimension of the main patterns.
申请公布号 US2005153466(A1) 申请公布日期 2005.07.14
申请号 US20050026100 申请日期 2005.01.03
申请人 CHOI YEON-DONG;BAEK KYOUNG-YUN 发明人 CHOI YEON-DONG;BAEK KYOUNG-YUN
分类号 H01L21/027;G03F1/14;G03F7/20;H01L21/66;H01L23/544;(IPC1-7):H01L21/66 主分类号 H01L21/027
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