发明名称 Memory device and fabrication method thereof
摘要 A method of forming a memory device, where a first insulator layer and a charge trapping layer may be formed on a substrate, and at least one of the first insulator layer and charge trapping layer may be patterned to form patterned areas. A second insulation layer and a conductive layer may be formed on the patterned areas, and one or more of the conductive layer, second insulator layer, charge trapping layer and first insulator layer may be patterned to form a string selection line, ground selection line, a plurality of word lines between the string selection and ground selection lines on the substrate, a low voltage gate electrode, and a plurality of insulators of varying thickness. The formed memory device may be a NAND-type non-volatile memory device having a SONOS gate structure, for example.
申请公布号 US2005152176(A1) 申请公布日期 2005.07.14
申请号 US20050048852 申请日期 2005.02.03
申请人 SHIN YOO-CHEOL;CHOI JEONG-HYUK;HUR SUNG-HOI 发明人 SHIN YOO-CHEOL;CHOI JEONG-HYUK;HUR SUNG-HOI
分类号 H01L21/8247;H01L21/8246;H01L27/115;(IPC1-7):G11C11/24 主分类号 H01L21/8247
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