Embossing method and apparatus

摘要

A method and apparatus for forming a patterned layer having a surface profile that provides relief structures within an electronic device. The method comprises the steps of taking a carrier film ( 50 ) having an inverse of the required surface profile formed on one side thereof, taking a layer of fixable material ( 54 ) located on a substrate ( 52 ), laminating the carrier film ( 50 ) and substrate ( 52 ) such the carrier film causes the required surface profile to be formed in the layer of fixable material with a predetermined offset, and then fixing the fixable material. Lamination may be performed using rollers ( 56,58 ) or a vacuum process. The process is designed to ensure that the offset can be kept as low as possible, preferably to within 150 nm.